Eliyan just secured $145 million in funding, pushing its valuation past $1 billion. This startup from Santa Clara is tackling one of AI’s toughest problems: the data traffic snarls inside chips. Their secret weapon is NuLink PHY, a new chiplet interconnect technology that bypasses expensive silicon interposers and lets different chip components talk faster and more efficiently.
Instead of relying on bulky, monolithic chips, AI hardware makers like AMD and Intel are moving toward multi-die setups where smaller chiplets work together. Eliyan’s innovation smooths the data highways between these chiplets, significantly improving bandwidth without hiking costs or power consumption.
The company has attracted heavy hitters such as AMD, Arm, Meta, Intel Capital, Micron Ventures, and SK hynix. their funding runs between $150 million and $157 million after a series of rounds, including $60 million raised in early 2024 and another $50 million in 2026.
This breakthrough resonates beyond semiconductors. As AI infrastructure spending ramps up, the pressure to solve interconnect issues is growing. Investors should keep an eye on publicly traded giants like AMD and Intel, as their embrace of chiplet-based designs will likely shape the next wave of AI hardware.
This information is for educational purposes and not financial advice.
